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ATS-1108-C1-R0

Name: Advanced Thermal Solutions ATS-1108-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-1108-C1-R0
Price: 16.39 EUR
Availability: InStock

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Mouser No:

984-ATS-1108-C1-R0

Mfr. No:

ATS-1108-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Power Brick Heat Sink, Full Brick, Gold, T766, Hardware, 117x61x6.1mm

Datasheet:

ATS-1108-C1-R0 Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS-1108-C1-R0

In Stock: 45

Stock:: 45 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	16,39 €	16,39 €
	14,51 €	145,10 €
	13,82 €	276,40 €
	13,32 €	666,00 €
	12,69 €	1.269,00 €
	12,07 €	2.414,00 €
	11,77 €	5.885,00 €
	11,73 €	11.730,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	DC/DC Converter, Full Brick
Mounting Style:	Screw
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	9.4 C/W
Length:	117 mm
Width:	61 mm
Height:	6.1 mm
Brand:	Advanced Thermal Solutions
Color:	Gold
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	Brick HS
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	DC/DC Converter

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Datasheet

ATS-1108-C1-R0 Datasheet (PDF)

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Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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TARIC:: 8504909000
CAHTS:: 8504909090
USHTS:: 8504909650
JPHTS:: 850490000
KRHTS:: 8504909000
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.