MFRC52202HN1,157

NXP Semiconductors
771-MFRC52202HN1157
MFRC52202HN1,157

Mfr.:

Description:
NFC/RFID Tags & Transponders CONTACTLESS READER IC

Lifecycle:
End of Life:
Scheduled for obsolescence and will be discontinued by the manufacturer.
ECAD Model:
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In Stock: 4.867

Stock:
4.867 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
6,99 € 6,99 €
5,42 € 54,20 €
4,88 € 122,00 €
4,59 € 459,00 €
4,38 € 1.095,00 €
4,25 € 2.125,00 €
4,23 € 4.230,00 €
4,00 € 9.800,00 €

Alternative Packaging

Mfr. Part No.:
Packaging:
Reel, Cut Tape, MouseReel
Availability:
In Stock
Price:
7,48 €
Min:
1

Product Attribute Attribute Value Select Attribute
NXP
Product Category: NFC/RFID Tags & Transponders
RoHS:  
13.56 MHz
+ 85 C
- 25 C
SMD/SMT
HVQFN-32
Tray
Brand: NXP Semiconductors
Function: Read/Write
Product: Standard performance MIFARE and NTAG frontend
Product Type: NFC/RFID Tags & Transponders
Series: MFRC522
Factory Pack Quantity: 2450
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
Part # Aliases: 935293912157
Unit Weight: 65,436 mg
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Attributes selected: 0

TARIC:
8542399000
CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
JPHTS:
854239099
MXHTS:
8542399901
ECCN:
EAR99

RF-IF Solutions

NXP Semiconductors RF-IF Solutions meet the needs of the most demanding RF applications by allowing designers to meet the highest specifications for performance while still retaining potential trade-offs with respect to efficiency, power, ruggedness, consistency, and integration levels. The NXP RF-IF portfolio covers the majority of communication and transmission systems, making it easy to find a solution that matches a designer's particular requirements. NXP RF-IF solutions include the SA6xx Series RF/IF building blocks that are ideal for a variety of niche handheld RF products. Available in small-footprint packages, SA6xx solutions save PCB space while providing better RF performance.