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HDTM-3-08-1-S-VT-5-R-2

Name: Samtec HDTM-3-08-1-S-VT-5-R-2
Brand: Samtec
SKU: 200-HDTM3081SVT5R2
Price: 10.51 EUR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-HDTM3081SVT5R2

Mfr. No:

HDTM-3-08-1-S-VT-5-R-2

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-3-08-1-S-VT-5-R-2 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-08-1-S-VT-5-R-2

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 4 Weeks Estimated factory production time.

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Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	10,51 €	10,51 €
	9,48 €	94,80 €
	8,45 €	211,25 €
	6,90 €	579,60 €
	6,36 €	1.602,72 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Product:	Headers
Number of Positions:	48 Position
Number of Rows:	8 Row
Pitch:	1.8 mm
Termination Style:	Solder Pin
Packaging:	Tray
Brand:	Samtec
Contact Material:	Phosphor Bronze
Current Rating:	1.5 A
Housing Material:	Liquid Crystal Polyer (LCP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Vertical
Orientation:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	42
Subcategory:	Backplane Connectors
Voltage Rating:	48 VAC

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Datasheet

HDTM-3-08-1-S-VT-5-R-2 Datasheet (PDF)

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.