TLVM13610RDFR

Texas Instruments
595-TLVM13610RDFR
TLVM13610RDFR

Mfr.:

Description:
Power Management Modules High-Density 3V to 36V Input 1V to 10V

ECAD Model:
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In Stock: 467

Stock:
467
Can Dispatch Immediately
On Order:
5.000
Expected 5/25/2026
Factory Lead Time:
12
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 1000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
7,31 € 7,31 €
5,68 € 56,80 €
5,27 € 131,75 €
4,82 € 482,00 €
4,60 € 1.150,00 €
4,47 € 2.235,00 €
Full Reel (Order in multiples of 1000)
4,36 € 4.360,00 €
4,27 € 8.540,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Power Management Modules
RoHS:  
Power Modules
36 V
1 V to 10 V
8 A
200 kHz to 2.2 MHz
Brand: Texas Instruments
Dimensions: 6.5 mm × 7.5 mm × 4 mm
Input Voltage - Min: 3 V
Load Regulation: Yes,Regulated
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Product Type: Power Management Modules
Series: TLVM13610
Factory Pack Quantity: 1000
Subcategory: Embedded Solutions
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CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

TLVM13610 Synchronous Buck DC/DC Power Module

Texas Instruments TLVM13610 Synchronous Buck DC/DC Power Module is a highly integrated 36V, 8A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has VIN and VOUT pins at the package's corners for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing. With an output voltage from 1V to 10V, the TLVM13610 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.