OSD6254-1G-IPM

Octavo Systems
415-OSD6254-1G-IPM
OSD6254-1G-IPM

Mfr.:

Description:
System-On-Modules - SOM System-in-Package: Texas Instruments AM6254 ARM Quad Cortex A53 Processor, 1GB DDR4, Passives - 9mm X 14mm 500 Ball BGA - -40C to 85C

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 128

Stock:
128 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
30,60 € 30,60 €
28,75 € 287,50 €
27,84 € 696,00 €
26,96 € 1.348,00 €
25,78 € 2.578,00 €
24,96 € 4.542,72 €
546 Quote

Product Attribute Attribute Value Select Attribute
Octavo Systems
Product Category: System-On-Modules - SOM
RoHS:  
OSD62x
1.8 V, 3.3 V
- 40 C
+ 85 C
Tray
Brand: Octavo Systems
Moisture Sensitive: Yes
Number of Cores: 5
Product Type: System-On-Modules - SOM
Factory Pack Quantity: 182
Subcategory: Computing
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Attributes selected: 0

CAHTS:
8542310000
USHTS:
8542310050
ECCN:
5A992.C

OSD62x-PM System-in-Package (SiP)

Octavo Systems OSD62x-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components. This device features up to quad-core 64-bit Arm® Cortex®-A53 at 1.4GHz, a single-core Arm® Cortex®-M4F at 400MHz, and up to 2GB of DDR4 memory. The OSD62x-PM SiP features a 3D graphics processing unit that supports up to 2048x1080 @60fps and OpenGL ES 3.1 and Vulkan 1.2. The display subsystem supports 2x 1920x1080 @ 60fps, 24-bit RGB parallel interface, and OLDI/LVDS (4 lanes-2x). The OSD62x-PM SiP is available in a single 9mm x 14mm BGA package with a -40°C to 85°C industrial temperature range. Typical applications include building and industrial automation/control, IoT gateway, Artificial Intelligence (AI) at the edge, and Human Machine Interface (HMI).