AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Number of Positions
Pitch
Number of Rows
Termination Style
Mounting Angle
Stack Height
Current Rating
Voltage Rating
Minimum Operating Temperature
Maximum Operating Temperature
Contact Plating
Contact Material
Housing Material
Packaging
TE Connectivity Board to Board & Mezzanine Connectors 2x4P TB HDR VT (180) 3.5, BK
Datasheet
Non-Stocked Lead-Time 14 Weeks
Min.: 900
Mult.: 900
Reel: 900

Headers 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G1 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 4.3 mm 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors 2x6P Spring TB Plug w/ Flg 3.5, BK
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 4.3 mm 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G3 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors 2x6P Spring TB Plug w/ SL 3.5, BK
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 2x9P Spring TB Plug w/ SL 3.5, BK
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Receptacles 26 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 3P TB HDR HZ (90) 2.50, GN
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Receptacles 26 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 3P TB HDR VT (180) 2.50, GN
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Receptacles 32 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 3P TB HDR VT (180) 3.5, GN
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Receptacles 32 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 5P Spring TB Plug 2.50, GN
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Receptacles 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Reel
TE Connectivity Board to Board & Mezzanine Connectors 5P Spring TB Plug 3.5, GN
Datasheet
Non-Stocked
Min.: 900
Mult.: 900
Reel: 900

Receptacles 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Reel
TE Connectivity Board to Board & Mezzanine Connectors 6P TB HDR VT (180) 3.5, GN
Datasheet
Non-Stocked
Min.: 810
Mult.: 810
Reel: 810

Receptacles 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 6P TB HDR VT (180) 3.81, GN
Datasheet
Non-Stocked
Min.: 810
Mult.: 810
Reel: 810

Receptacles 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 7P TB HDR VT (180) 3.5, GN
Datasheet
Non-Stocked
Min.: 810
Mult.: 810
Reel: 810

Receptacles 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 7P TB HDR VT (180) 3.81, GN
Datasheet
Non-Stocked
Min.: 810
Mult.: 810
Reel: 810

Receptacles 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 040 SMT G1 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 525
Mult.: 525

Headers 40 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 040 SMT G3 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 525
Mult.: 525

Headers 40 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G1 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G1 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1.680
Mult.: 1.680

Headers 12 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 016 SMT G1 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1.260
Mult.: 1.260

Headers 16 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G3 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G3 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1.680
Mult.: 1.680

Headers 12 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 016 SMT G3 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1.260
Mult.: 1.260

Headers 16 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 068 SMT G1 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 315
Mult.: 315

Headers 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 068 SMT G3 TBK
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 315
Mult.: 315

Headers 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube