XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS
Samtec HDTM-6-08-1-S-VT-4-L-1-B
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Samtec HDTM-6-08-1-S-VT-4-L-1-G
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 50
Mult.: 50
Samtec HDTM-6-08-1-S-VT-4-L-2-A
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Samtec HDTM-6-08-1-S-VT-5-R-2-A
Samtec Headers & Wire Housings XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Samtec HPTT-4-S-6-6-6-D-RA
Samtec Samtec XCede HD Power Module Non-Stocked Lead-Time 14 Weeks
Min.: 1
Mult.: 1