ESP32-PICO-V3-02

Espressif Systems
356-ESP32-PICO-V3-02
ESP32-PICO-V3-02

Mfr.:

Description:
RF System on a Chip - SoC Module in SiP form, ESP32 ECO V3 with 8 MB flash and 2 MB PSRAM inside, dual-core MCU, Wi-Fi & Bluetooth combo, LGA 48-pin, 7*7 mm

ECAD Model:
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In Stock: 4.720

Stock:
4.720 Can Dispatch Immediately
Factory Lead Time:
52 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
4,91 € 4,91 €
4,26 € 42,60 €
4,02 € 100,50 €
3,71 € 371,00 €
3,52 € 880,00 €
3,39 € 1.695,00 €
3,07 € 3.070,00 €
Full Reel (Order in multiples of 2000)
2,74 € 5.480,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Espressif
Product Category: RF System on a Chip - SoC
RoHS:  
Bluetooth, Wi-Fi
RISC
2.4 GHz
150 Mbps
19.5 dBm
- 75 dBm
3 V
3.6 V
116 mA
233 mA
4 MB
- 40 C
+ 85 C
LGA-48
Reel
Cut Tape
MouseReel
Brand: Espressif Systems
Data Bus Width: 32 bit
Data RAM Size: 2 MB
Data RAM Type: PSRAM
Height: 1.11 mm
Interface Type: I2C, I2S, SPI, UART
Length: 7 mm
Maximum Clock Frequency: 240 MHz
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Processor Series: ESP-32
Product Type: RF System on a Chip - SoC
Program Memory Type: Flash
Factory Pack Quantity: 2000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
Width: 7 mm
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Attributes selected: 0

TARIC:
8517620000
CNHTS:
8542319090
CAHTS:
8542310000
USHTS:
8542310070
JPHTS:
851762090
ECCN:
5A992.C

ESP32-PICO-V3-02 SiP Module

Espressif Systems ESP32-PICO-V3-02 SiP Module is a system-in-package (SiP) device based on the ESP32 with ECO V3 wafer. The module provides complete Wi-Fi® and BLUETOOTH® functionalities and integrates 8MB SPI flash and 2MB SPIPSRAM. At the core of the module is the ESP32 (ECO V3) chip, a single 2.4GHz Wi-Fi and Bluetooth combo chip designed with TSMC's 40nm low-power technology. Espressif Systems ESP32-PICO-V3-02 SiP Module includes all peripheral components such as a crystal oscillator, flash, PSRAM, filter capacitors, and RF matching links. Assembly and testing are already done at the SiP level. The ESP32-PICO-V3-02 reduces the complexity of supply chains and improves control efficiency.