EVM-LEADLESS1

Texas Instruments
595-EVM-LEADLESS1
EVM-LEADLESS1

Mfr.:

Description:
Switch IC Development Tools LEADLESS PACKAGE BRE AKOUT BOARD EVM

Datasheet:
More Information
Learn more about Texas Instruments EVM-LEADLESS1

In Stock: 6

Stock:
6 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1   Maximum: 5
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
11,18 € 11,18 €

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Switch IC Development Tools
RoHS: N
Evaluation Modules
Multiple Switches
Brand: Texas Instruments
For Use With: Leadless packages
Product Type: Switch IC Development Tools
Factory Pack Quantity: 1
Subcategory: Development Tools
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Attributes selected: 0

Datasheet

Compliance Codes
CNHTS:
8543909000
CAHTS:
8534000099
USHTS:
8534000095
JPHTS:
853400000
ECCN:
EAR99
Origin Classifications
Country of Origin:
United States
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

EVM-LEADLESS1 DIP Header Adapter Board

Texas Instruments EVM-LEADLESS1 DIP Header Adapter Board allows for quick testing and breadboarding of TI's standard leadless packages. The adapter board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW, RTE, RTJ, RUK, RUC, RUG, RUM, RUT, and YZP surface mount packages to 100mil DIP headers.

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