Embedded Solutions

Results: 595
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked
Min.: 240
Mult.: 240

ISSI IS43LR32400G-6BLI
ISSI DRAM 128M, 1.8V, Mobile DDR, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 10 Weeks
Min.: 240
Mult.: 240

ADLINK Technology DDR4 2400 260P 8GB NON ECC SO DIMM
ADLINK Technology Memory Modules Non-Stocked
Min.: 1
Mult.: 1
SpotSee Multiple Function Sensor Modules 65 Clip: Single Tube - CX65 - 25G

ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked Lead-Time 16 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

ISSI IS43LR32400G-6BLI-TR
ISSI DRAM 128M, 1.8V, Mobile DDR, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 10 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

ISSI DRAM 128M, 3.3V, SDRAM, 4Mx32, 143Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked Lead-Time 14 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked
Min.: 2.500
Mult.: 2.500
Reel: 2.500

ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86 pin TSOP II (400 mil) RoHS, T&R Non-Stocked
Min.: 1.500
Mult.: 1.500
Reel: 1.500

ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked
Min.: 240
Mult.: 240

ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 86 pin TSOP II (400 mil) RoHS, T&R Non-Stocked Lead-Time 16 Weeks
Min.: 1.500
Mult.: 1.500
Reel: 1.500

ADLINK Technology DDR4 2400 260P 4GB SODIMM 1Rx8
ADLINK Technology Memory Modules DDR4-2400, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL17, Non-ECC, OP Temp:0 85, Fix Die:No(F-die), Samsung Chip(512Mx8) Non-Stocked
Min.: 1
Mult.: 1
JUMPtec Computer-On-Modules - COM JUMPtec COMe-cAL6 E2 E3930 N/A
Min.: 1
Mult.: 1

ADLINK Technology DDR4 2400 260P 8GB NON-ECC SODIMM INDUS
ADLINK Technology Memory Modules DDR4-2400, 8GB, 1024Mx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(512M x8*16 ) height:30mm Non-Stocked
Min.: 1
Mult.: 1
ADLINK Technology DDR4 2400 260P 16GB NON ECCSO DIMM
ADLINK Technology Memory Modules DDR4-2400, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, Non-ECC, OP Temp:-40-85, Fix Die:No, Chip(1Gx8), with comformal coating Non-Stocked
Min.: 1
Mult.: 1
congatec Computer-On-Modules - COM COM-HPC Size D module based on Intel Xeon D1715TER 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2400 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range. Non-Stocked
Min.: 1
Mult.: 1
Eurotech Interface Modules PC/104 MVB Interface Module Device Non-Stocked
Min.: 10
Mult.: 1

ISSI IS43LR32400G-6BL
ISSI DRAM 128M, 1.8V, Mobile DDR, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 10 Weeks
Min.: 240
Mult.: 240

JUMPtec Computer-On-Modules - COM JUMPtec COMe-cKL6 i5-7300U 4GB N/A
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-cAL6 E2 E3950 Non-Stocked
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM COM-HPC Size D module based on Intel Xeon D1732TE 8-core processor with tbd GHz, 15MB cache and dual channel DDR4 2400 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range. Non-Stocked
Min.: 1
Mult.: 1
ISSI IS43LR32400G-6BL-TR
ISSI DRAM 128M, 1.8V, Mobile DDR, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked Lead-Time 10 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

JUMPtec Computer-On-Modules - COM JUMPtec COMe-cAL6 E2 E3940 Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Advantech Rack Mount / Server PCs 4U Rackmount Xeon E5-2400 Video Wall Controller System, supports up to 2 x Matrox Mura MPX-4/4 Non-Stocked
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-cAL6 E2 E3950 32S PCIe Non-Stocked
Min.: 1
Mult.: 1