SyncBurst SRAMs

GSI Technology SyncBurst SRAMs are a broad portfolio of Synchronous Burst (SyncBurst™) SRAMs with fast clock rates and low power. SyncBurst SRAMs provide a "burst" of (typically) 2 to 4 words in response to a single clock signal. The devices' simplified interface is designed to use a data bus's maximum bandwidth. GSI Technology SyncBurst SRAMs are used in military, networking, industrial, automotive, and medical imaging applications where a mid-range performance point is required.

Results: 2.420
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Memory Size Organisation Access Time Maximum Clock Frequency Interface Type Supply Voltage - Max Supply Voltage - Min Supply Current - Max Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package/Case Packaging
GSI Technology SRAM 1.8/2.5V 1M x 72 72M 1In Stock
Min.: 1
Mult.: 1

72 Mbit 1 M x 72 6.5 ns 250 MHz Parallel 2.7 V 1.7 V 340 mA, 480 mA - 40 C + 85 C SMD/SMT BGA-209 Tray
GSI Technology SRAM 2.5/3.3V 8M x 36 288M 30In Stock
Min.: 1
Mult.: 1

288 Mbit 8 M x 36 4 ns 400 MHz Parallel 3.6 V 2.3 V 560 mA, 840 mA - 40 C + 100 C SMD/SMT BGA-119 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 18 9M 37In Stock
Min.: 1
Mult.: 1
9 Mbit 512 k x 18 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 150 mA, 175 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 256K x 36 9M 2In Stock
Min.: 1
Mult.: 1

9 Mbit 256 k x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 160 mA, 190 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 2M x 36 72M
135Expected 2/19/2027
Min.: 1
Mult.: 1

72 Mbit 2 M x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 270 mA, 345 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 1M x 18 18M
18Expected 8/4/2026
Min.: 1
Mult.: 1

18 Mbit 1 M x 18 7.5 ns 150 MHz Parallel 3.6 V 2.3 V 190 mA, 200 mA - 40 C + 100 C SMD/SMT TQFP-100 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 36 18M
36Expected 8/3/2026
Min.: 1
Mult.: 1

18 Mbit 512 k x 36 7.5 ns 150 MHz Parallel 3.6 V 2.3 V 200 mA, 210 mA - 40 C + 100 C SMD/SMT TQFP-100 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 36 18M
36Expected 8/28/2026
Min.: 1
Mult.: 1

18 Mbit 512 k x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 230 mA - 40 C + 100 C SMD/SMT TQFP-100 Tray
GSI Technology SRAM 2.5 or 3.3V 1M x 36 36M
18Expected 8/4/2026
Min.: 1
Mult.: 1

36 Mbit 1 M x 36 7.5 ns 150 MHz Parallel 3.6 V 2.3 V 210 mA, 220 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 256K x 36 9M
32Expected 8/28/2026
Min.: 1
Mult.: 1

9 Mbit 256 k x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 160 mA, 190 mA - 40 C + 85 C SMD/SMT BGA-119 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 36 18M
36Expected 1/18/2027
Min.: 1
Mult.: 1

18 Mbit 512 k x 36 5.5 ns 250 MHz Parallel 3.6 V 2.3 V 230 mA, 250 mA 0 C + 70 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 1M x 36 36M
18Expected 8/4/2026
Min.: 1
Mult.: 1
No
36 Mbit 1 M x 36 7.5 ns 150 MHz Parallel 3.6 V 2.3 V 190 mA, 200 mA 0 C + 70 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 1.8/2.5V 8M x 18 144M Non-Stocked Lead-Time 12 Weeks
Min.: 15
Mult.: 15

144 Mbit 8 M x 18 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 295 mA, 360 mA 0 C + 85 C SMD/SMT TQFP-100 Tray
GSI Technology SRAM 1.8/2.5V 4M x 36 144M Non-Stocked Lead-Time 3 Weeks
Min.: 10
Mult.: 10

144 Mbit 4 M x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 330 mA, 400 mA 0 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 36 18M Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
18 Mbit 512 k x 36 5.5 ns 250 MHz Parallel 3.6 V 2.3 V 250 mA, 270 mA - 40 C + 85 C SMD/SMT BGA-119 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 36 18M Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
18 Mbit 512 k x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 230 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5/3.3V 8M x 36 288M Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

288 Mbit 8 M x 36 5.5 ns 250 MHz Parallel 3.6 V 2.3 V 520 mA, 610 mA - 40 C + 100 C SMD/SMT BGA-119 Tray
GSI Technology SRAM 2.5 or 3.3V 1M x 32 32M Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

36 Mbit 1 M x 32 7.5 ns 150 MHz Parallel 3.6 V 2.3 V 210 mA, 220 mA - 40 C + 85 C SMD/SMT TQFP-100 Tray
GSI Technology SRAM 2.5 or 3.3V 4M x 18 36M Non-Stocked Lead-Time 3 Weeks
Min.: 14
Mult.: 14
72 Mbit 4 M x 18 7.5 ns 200 MHz Parallel 3.6 V 2.3 V 225 mA, 290 mA - 40 C + 85 C SMD/SMT BGA-119 Tray
GSI Technology SRAM 2.5 or 3.3V 2M x 36 72M
Non-Stocked Lead-Time 4 Weeks
Min.: 14
Mult.: 14
72 Mbit 2 M x 36 6.5 ns 250 MHz Parallel 3.6 V 2.3 V 300 mA, 435 mA - 55 C + 125 C SMD/SMT BGA-119 Tray
GSI Technology SRAM 2.5 or 3.3V 512K x 18 9M Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

9 Mbit 512 k x 18 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 150 mA, 175 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM 2.5 or 3.3V 256K x 32 8M Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1
9 Mbit 256 k x 36 6.5 ns 200 MHz Parallel 3.6 V 2.3 V 160 mA, 190 mA - 40 C + 85 C SMD/SMT BGA-165 Tray
GSI Technology SRAM
Non-Stocked
Min.: 21
Mult.: 21
18 Mbit 256 k x 72 5 ns 300 MHz Parallel 3.6 V 2.3 V 340 mA, 465 mA - 55 C + 125 C SMD/SMT BGA-209
GSI Technology SRAM
Non-Stocked
Min.: 14
Mult.: 14
36 Mbit 2 M x 18 5.5 ns 250 MHz Parallel 3.6 V 2.3 V 290 mA - 55 C + 125 C SMD/SMT BGA-165
GSI Technology SRAM
Non-Stocked
Min.: 14
Mult.: 14
36 Mbit 2 M x 18 5.5 ns 250 MHz Parallel 3.6 V 2.3 V 290 mA - 55 C + 125 C SMD/SMT BGA-165