16 bit DRAM

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Type
Memory Size
Data Bus Width
Maximum Clock Frequency
Package/Case
Organisation
Access Time
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Alliance Memory DRAM SDR, 512Mb, 32M x 16, 3.3V, 54-ball FBGA, 143MHz, Industrial Temp, B Die,T&R
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM 512 Mbit 16 bit 143 MHz FBGA-54 32 M x 16 5.4 ns 3 V 3.6 V - 40 C + 85 C Reel
Zentel Japan DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000

SDRAM - DDR2 512 Mbit 16 bit 400 MHz FPGA-84 32 M x 16 400 ps 1.7 V 1.9 V - 40 C + 105 C DDR2 Tray
Zentel Japan DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000

SDRAM - DDR2 512 Mbit 16 bit 400 MHz FPGA-84 32 M x 16 400 ps 1.7 V 1.9 V - 40 C + 95 C DDR2 Tray
Zentel Japan DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000

SDRAM - DDR2 1 Gbit 16 bit 400 MHz FPGA-84 64 M x 16 400 ps 1.7 V 1.9 V - 40 C + 105 C DDR2 Tray
Zentel Japan DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000

SDRAM - DDR2 1 Gbit 16 bit 400 MHz FPGA-84 64 M x 16 400 ps 1.7 V 1.9 V - 40 C + 95 C DDR2 Tray
Zentel Japan DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.080
Mult.: 1.080

SDRAM - DDR 512 Mbit 16 bit 200 MHz TSOP-II-66 32 M x 16 700 ps 2.3 V 2.7 V - 40 C + 85 C DDR1 Tray
Zentel Japan DRAM DDR1 256Mb, 16Mx16, 200MHz at CL3, 2.5V, TSOPII-66, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.080
Mult.: 1.080

SDRAM - DDR 256 Mbit 16 bit 200 MHz TSOP-II-66 16 M x 16 700 ps 2.3 V 2.7 V - 40 C + 85 C DDR1 Tray
Zentel Japan DRAM DDR3 1Gb, 64Mx16, 1600 at CL11, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.900
Mult.: 1.900

SDRAM - DDR3 1 Gbit 16 bit 800 MHz FPGA-96 64 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3L 1Gb, 64Mx16, 1600 at CL11, 1.35V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.900
Mult.: 1.900

SDRAM - DDR3L 1 Gbit 16 bit 800 MHz FPGA-96 64 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3L Tray
Zentel Japan DRAM DDR3 1Gb, 64Mx16, 1866 at CL13, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.900
Mult.: 1.900

SDRAM - DDR3 1 Gbit 16 bit 933 MHz FPGA-96 64 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3 2 Gbit 16 bit 1.066 GHz FPGA-96 128 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3 4 Gbit 16 bit 1.066 GHz FPGA-96 256 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3L 8Gb, 512Mx16 (1CS, 1ZQ), 1600 at CL11, 1.35V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.900
Mult.: 1.900

SDRAM - DDR3L 8 Gbit 16 bit 800 MHz FPGA-96 512 M x 16 1.283 V 1.45 V 0 C + 95 C DDR3L Tray
ISSI DRAM 16G, 1.35V, DDR3L, 1Gx16,1600MT/s @ 11-11-11, 96 ball BGA (10mm x 14mm) RoHS, T&R
Datasheet
Non-Stocked
Min.: 2.000
Mult.: 1
SDRAM - DDR3 16 Gbit 16 bit 933 MHz BGA-96 1 G x 16 20 ns 1.425 V 1.575 V 0 C + 95 C IS43TR16K01S2L
ISSI DRAM 16G, 1.35V, DDR3L, 1Gx16,1600MT/s @ 11-11-11, 96 ball BGA (10mm x 14mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 34 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000
SDRAM - DDR3L 16 Gbit 16 bit 933 MHz BGA-96 1 G x 16 20 ns 1.283 V 1.45 V - 40 C + 95 C IS43TR16K01S2L Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 1.06 V 1.17 V - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 1.06 V 1.17 V - 40 C + 105 C Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 105 C Tray
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 105 C Reel
ISSI DRAM 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +115C), 2G, 1.5V, DDR3, 128Mx16, 1600MT/s @ 11-11-11, 96 ball BGA (9mm x13mm) RoHS
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 190
Mult.: 190
SDRAM - DDR3 2 Gbit 16 bit 933 MHz BGA-96 128 M x 16 20 ns 1.425 V 1.575 V - 40 C + 105 C IS46TR16128C
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4 16 bit 1.6 GHz BGA-200 256 M x 16 1.06 V 1.17 V - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4 16 bit 1.6 GHz BGA-200 256 M x 16 1.06 V 1.17 V - 40 C + 105 C Reel