Multiprotocol Modules

Results: 1.595
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Qualification Packaging
Murata Electronics Multiprotocol Modules Type 1ZM Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
2.000Expected 1/21/2027
Min.: 1
Mult.: 1
: 1.000

1ZM 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.92 V - 30 C + 85 C u.FL 10.2 mm x 9.3 mm x 1.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Reel, Cut Tape
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors Multiprotocol Modules IW611UK/A1I
25Expected 8/21/2026
Min.: 1
Mult.: 1
: 2.000

IW611HN Reel, Cut Tape
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors Multiprotocol Modules IW612UK/A1I
25Expected 8/21/2026
Min.: 1
Mult.: 1
: 2.000

IW612HN Reel, Cut Tape
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, North America, mPCIe form factor
394On Order
Min.: 1
Mult.: 1
: 100

700 MHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, South Korea, Thailand, India
385Expected 6/1/2026
Min.: 1
Mult.: 1
: 100

698 MHz to 960 MHz, 1.561 GHz, 1.575 GHz, 1.7 GHz to 2.7 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C External 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
984Expected 9/18/2026
Min.: 1
Mult.: 1
: 1.000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 1DX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.1
920Expected 6/9/2026
Min.: 1
Mult.: 1
: 1.000

1DX 2.4 GHz 17 dBm SDIO, UART 1.71 V 3.63 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm Bluetooth 4.1 802.11 b/g/n Reel, Cut Tape, MouseReel
Murata Electronics Multiprotocol Modules Type 2FR module
975Expected 11/3/2026
Min.: 1
Mult.: 1
: 1.000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape

Murata Electronics Multiprotocol Modules Type 2BP NXP SR150 UWB MODULE
999Expected 9/23/2026
Min.: 1
Mult.: 1
: 1.000

UWB 6.25 GHz to 8.25 GHz SPI - 30 C + 85 C 6.6 mm x 5.8 mm x 1.2 mm Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 1XK Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
972Expected 12/24/2026
Min.: 1
Mult.: 1
: 500

1XK 2.4 GHz, 5 GHz UART 2.7 V 5.5 V - 40 C + 85 C u.FL 9.1 mm x 8.3 mm x 1.3 mm Bluetooth 5.2 Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
500Expected 8/20/2026
Min.: 1
Mult.: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2 - Standard version + GNSS (w/o WWAN concurrency)
791On Order
Min.: 1
Mult.: 1
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS Reel, Cut Tape, MouseReel
Quectel Multiprotocol Modules Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, data only application, North America, mPCIe form factor
100On Order
Min.: 1
Mult.: 1

824 MHz to 960 MHz, 1.71 GHz to 2.17 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel Multiprotocol Modules Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, South Korea, Thailand, India
250Expected 8/4/2026
Min.: 1
Mult.: 1
: 250

700 MHz to 960 MHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
289On Order
Min.: 1
Mult.: 1
: 100

1.16 GHz to 1.27 GHz, 1.56 GHz to 1.605 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
99Expected 8/6/2026
Min.: 1
Mult.: 1

Tray
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, Japan only, mPCIe form factor
100Expected 6/29/2026
Min.: 1
Mult.: 1
: 100

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C Patch 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
250Expected 6/1/2026
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 1 + 3G + 2G, mPCIe form factor, Global
200Expected 8/26/2026
Min.: 1
Mult.: 1
: 100

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C 51 mm x 30 mm x 4.9 mm LTE Cat 1 GNSS Reel, Cut Tape
SparkFun Multiprotocol Modules ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
29On Order
Min.: 1
Mult.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
110On Order
Min.: 1
Mult.: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Telink Multiprotocol Modules The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications. Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee
Fanstel Multiprotocol Modules Low cost nRF52833 BLE 5.4 module, 512KB flash,128KB RAM, u.FL Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
: 1.000

Reel, Cut Tape
Fanstel Multiprotocol Modules Opensource BT40F BLE 5.4 to nRF9160 LTE gateway.
Non-Stocked Lead-Time 12 Weeks
Min.: 25
Mult.: 25
: 25

Reel