Reel Multiprotocol Modules

Results: 755
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Qualification Packaging
Microchip Technology ATWINC3400-MR210CA142-T
Microchip Technology Multiprotocol Modules ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R Non-Stocked
Min.: 1
Mult.: 1
: 500
2.4 GHz 18.3 dBm 3 V 4.2 V - 40 C + 85 C u.FL 22.43 mmx 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Silicon Labs MGM12P22F1024GE-V4R
Silicon Labs Multiprotocol Modules Mighty Gecko M4 Mod 1024 kBflash 256 kB Non-Stocked Lead-Time 20 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

Reel
Silicon Labs RS916NS00AC0A3R
Silicon Labs Multiprotocol Modules Non-Stocked
Min.: 700
Mult.: 700
: 700

Reel
Silicon Labs RS916NS00AC1A3R
Silicon Labs Multiprotocol Modules Non-Stocked
Min.: 700
Mult.: 700
: 700

Reel
Silicon Labs RS916WS00AC0A3R
Silicon Labs Multiprotocol Modules Non-Stocked
Min.: 700
Mult.: 700
: 700

Reel
Silicon Labs RS916WS00AC1A3R
Silicon Labs Multiprotocol Modules Non-Stocked
Min.: 1
Mult.: 1
: 700

Reel, Cut Tape
Infineon Technologies CYSBSYS-RP01
Infineon Technologies Multiprotocol Modules SUBSYSTEM Non-Stocked Lead-Time 52 Weeks
Min.: 500
Mult.: 500
: 500

Reel
Infineon Technologies CYW89820BWMLGT
Infineon Technologies Multiprotocol Modules BT DM AUTO Non-Stocked Lead-Time 26 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

Reel
NXP Semiconductors IW611UK/A1CZ
NXP Semiconductors Multiprotocol Modules IW611UK/A1C Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

IW611HN Reel
NXP Semiconductors IW612UK/A1CZ
NXP Semiconductors Multiprotocol Modules IW612UK/A1C Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

IW612HN Reel
NXP Semiconductors IW620HN/B1CPMP
NXP Semiconductors Multiprotocol Modules IW620HN/B1CP Non-Stocked Lead-Time 16 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

IW620 Reel
Murata Electronics LBAD0YW1SS-530
Murata Electronics Multiprotocol Modules Type 1SS Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
Non-Stocked Lead-Time 20 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

1SS Reel
Jorjin Multiprotocol Modules Based on TI WL1833 and supports 802.11a/b/g/n and BT/BLE 4.2 Non-Stocked
Min.: 1.800
Mult.: 1.800
: 1.800

2.4 GHz, 5 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C 12.8 mm x 12 mm x 1.63 mm Bluetooth 802.11 a/b/g/n Reel
Silex Technology Multiprotocol Modules Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6 Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace. does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules 2x2 Dual Band 802.11 ac WLAN+BT SMT Non-Stocked Lead-Time 30 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 12 mm x 16 mm x 1.5 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEAX-SMT is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount form factor. It is based on Qualcomm's QCA2066 chipset. Non-Stocked Lead-Time 40 Weeks
Min.: 1.200
Mult.: 1.200
: 1.200

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. Non-Stocked Lead-Time 30 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Reel
Silex Technology Multiprotocol Modules Wi-Fi+BLE Mod SM w/Ant uFl connector Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules Wi-Fi+BLE Mod 2 ufl connectors Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac WLAN + BLE 4.2 SDIO Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500
2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac WLAN + BLE 4.2 SDIO Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500

2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module Non-Stocked Lead-Time 26 Weeks
Min.: 500
Mult.: 500
: 500

SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac SDIO SiP 2.4/5 GHz Non-Stocked Lead-Time 34 Weeks
Min.: 3.000
Mult.: 3.000
: 3.000

SX-SDPAC 2.4 GHz, 5 GHz SDIO, UART 3.3 V 3.3 V - 20 C + 70 C 6.9 mm x 6.9 mm x 1.082 mm Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules Surface Mount Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500

SX-USBAC 2.4 GHz, 5 GHz USB 3.3 V 3.3 V - 20 C + 85 C On Board 22 mm x 21 mm x 2.75 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel