-ar Multiprotocol Modules

Results: 197
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Packaging
Quectel Multiprotocol Modules Cat M1 Only, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency) 154In Stock
Min.: 1
Mult.: 1
Reel: 250

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency) 240In Stock
Min.: 1
Mult.: 1
Reel: 250

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency) 97In Stock
500Expected 5/25/2026
Min.: 1
Mult.: 1
Reel: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotocol Modules Embedded, 0-6000, Cable assembly, 150mm, -, SMA-female to IPEX MHFI 10In Stock
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS
Quectel Multiprotocol Modules Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1 1In Stock
Min.: 1
Mult.: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel Multiprotocol Modules Embedded, 1559-1606, GNSS L1, Ceramic, -, -, Pin Mounting, 25 25 4 2In Stock
Min.: 1
Mult.: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS
Fanstel Multiprotocol Modules BLE 5.1 nRF52833 DF U.FL Connector
2.704On Order
Min.: 1
Mult.: 1
Reel: 1.000

BM833 2.4 GHz 8 dBm I2C, I2S, SPI, UART 1.7 V 5.5 V - 40 C + 105 C u.FL 10.2 mm x 15 mm x 1.9 mm Bluetooth 5.1 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE 84In Stock
Min.: 1
Mult.: 1
Reel: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
CEL Multiprotocol Modules ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3In Stock
Min.: 1
Mult.: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Quectel Multiprotocol Modules Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 34In Stock
Min.: 1
Mult.: 1
Reel: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Ezurio Multiprotocol Modules Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape (Infineon ARM Cortex 33 Airoc CYW55912)
250Expected 8/14/2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotocol Modules Wi-Fi Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
250Expected 8/14/2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotocol Modules Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
250Expected 8/20/2026
Min.: 1
Mult.: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotocol Modules BL654 - Bluetooth v5 / 802.15.4 / NFC Module (Nordic nRF52840) External Antenna - Cut Tape
500Expected 2/23/2026
Min.: 1
Mult.: 1

BL654 2.4 GHz 8 dBm GPIO, I2C, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C IPEX 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Embedded Artists Multiprotocol Modules 2GF M.2 Module
21Expected 3/2/2026
Min.: 1
Mult.: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Microchip Technology Multiprotocol Modules Bluetooth Low Energy/Zigbee Combo Module with PCB Antenna and extended temperature
144Expected 7/24/2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics Multiprotocol Modules Type 2FR module
975Expected 10/13/2026
Min.: 1
Mult.: 1
Reel: 1.000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified Non-Stocked Lead-Time 12 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel

Embedded Artists Multiprotocol Modules 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
Non-Stocked Lead-Time 10 Weeks
Min.: 1.000
Mult.: 1

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Embedded Artists Multiprotocol Modules 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Silicon Labs Multiprotocol Modules Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module Non-Stocked Lead-Time 12 Weeks
Min.: 1.000
Mult.: 1.000
Reel: 1.000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel
Silicon Labs Multiprotocol Modules Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Cut Tape
Ezurio Multiprotocol Modules Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip, Trace Pin Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
Reel: 1.000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel
Ezurio Multiprotocol Modules Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
Reel: 1.000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel
Ezurio Multiprotocol Modules Bluetooth Module, BL54L10, Bluetooth LE, nRF54L10 chip, MHF4, T&R Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
Reel: 1.000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel