ATP Electronics Memory ICs

Results: 2.151
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product Type
Mounting Style
Package/Case
Memory Size
Interface Type
Minimum Operating Temperature
Maximum Operating Temperature
Qualification
Packaging
ATP Electronics Memory Modules Non-Stocked Lead-Time 29 Weeks
Min.: 50
Mult.: 50
Memory Modules
ATP Electronics Memory Modules Non-Stocked Lead-Time 29 Weeks
Min.: 50
Mult.: 50
Memory Modules
ATP Electronics Memory Modules Non-Stocked Lead-Time 29 Weeks
Min.: 50
Mult.: 50
Memory Modules
ATP Electronics Memory Modules Non-Stocked Lead-Time 29 Weeks
Min.: 50
Mult.: 50
Memory Modules
ATP Electronics Memory Modules Non-Stocked Lead-Time 29 Weeks
Min.: 50
Mult.: 50
Memory Modules
ATP Electronics Memory Modules Non-Stocked Lead-Time 29 Weeks
Min.: 50
Mult.: 50
Memory Modules
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 10 GB eMMC 5.1 HS400 - 25 C + 85 C
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 10 GB eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 21 GB eMMC 5.1 HS400 - 25 C + 85 C
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 21 GB eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 1.050
Mult.: 1.050
eMMC SMD/SMT FBGA-153 32 GB eMMC 5.1 HS400 - 25 C + 85 C
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 32 GB eMMC 5.1 HS400 - 25 C + 85 C
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 32 GB eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 1.050
Mult.: 1.050
eMMC SMD/SMT BGA-153 32 GB eMMC 5.1 - 25 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 1.050
Mult.: 1.050
eMMC SMD/SMT BGA-153 32 GB eMMC 5.1 - 40 C + 85 C
ATP Electronics Solid State Drives - SSD NVMe Gen3x4 BGA SSD w/ Heat Sink, 0C to +70C, GPIO Features Non-Stocked Lead-Time 29 Weeks
Min.: 390
Mult.: 390
Solid State Drives - SSD
ATP Electronics Solid State Drives - SSD NVMe Gen3x4 BGA SSD w/ Heat Sink, -40C to +85C, GPIO Features Non-Stocked Lead-Time 29 Weeks
Min.: 1
Mult.: 1
Solid State Drives - SSD
ATP Electronics Solid State Drives - SSD Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
Solid State Drives - SSD
ATP Electronics Solid State Drives - SSD Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
Solid State Drives - SSD
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 64 GB eMMC 5.1 HS400 - 25 C + 85 C
ATP Electronics eMMC
Datasheet
Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
eMMC SMD/SMT FBGA-153 64 GB eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE) Non-Stocked Lead-Time 40 Weeks
Min.: 1.050
Mult.: 1.050
eMMC SMD/SMT BGA-153 64 GB eMMC 5.1 - 25 C + 85 C
ATP Electronics eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE) Non-Stocked Lead-Time 40 Weeks
Min.: 1.050
Mult.: 1.050
eMMC SMD/SMT BGA-153 64 GB eMMC 5.1 - 40 C + 85 C
ATP Electronics Solid State Drives - SSD NVMe Gen3x4 BGA SSD w/ Heat Sink, 0C to +70C, GPIO Features Non-Stocked Lead-Time 29 Weeks
Min.: 390
Mult.: 390
Solid State Drives - SSD
ATP Electronics Solid State Drives - SSD NVMe Gen3x4 BGA SSD w/ Heat Sink, -40C to +85C, GPIO Features Non-Stocked Lead-Time 29 Weeks
Min.: 390
Mult.: 390
Solid State Drives - SSD