QII-0.006-AC-12/250

Bergquist Company
951-QII0.006AC12250
QII-0.006-AC-12/250

Mfr.:

Description:
Thermal Interface Products SIL PAD, Foil-Format Grease, 0.006" Thickness, 1 Side Adhesive, 12"x250' Roll
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2.549,95 € 2.549,95 €
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Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Q-Pad Grease Replacement Thermal Interface
Non-standard
Silicone Elastomer
Black
- 60 C
+ 180 C
228.6 mm
228.6 mm
0.152 mm
UL 94 V-0
II / TSP Q2500
Brand: Bergquist Company
Designed for: Replacing Thermal Grease
Height: 355.6 mm
Product Type: Thermal Interface Products
Size: 12 in x 250 ft
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Q-Pad / Sil-Pad
Part # Aliases: BG411845 2189390
Unit Weight: 8,391 kg
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Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

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