ARM Cortex M4 Core Bluetooth Modules - 802.15.1

Results: 67
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Protocol Class Interface Type Output Power Data Rate Receiver Sensitivity Frequency Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
Silicon Labs Bluetooth Modules - 802.15.1 Non-Stocked
Min.: 1.000
Mult.: 1.000
: 1.000

BGM111 BLE, Bluetooth 4.1 Serial 8 dBm 1 Mb/s - 92 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Reel
Silicon Labs Bluetooth Modules - 802.15.1 BGM11S Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1
: 1.000

BGM11S BLE, Bluetooth 4.2 I2C, UART, USART 3 dBm 1 Mb/s - 90 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth Modules - 802.15.1 BGM121 Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1
: 1.000

BGM121 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART, USART 8 dBm 1 Mb/s - 90 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin Non-Stocked Lead-Time 20 Weeks
Min.: 1.300
Mult.: 1.300

BGM123 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART, USART 2 dBm 1 Mb/s - 90 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Tray
Silicon Labs Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin Non-Stocked Lead-Time 20 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

BGM123 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART, USART 2 dBm 1 Mb/s - 90 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Reel
Silicon Labs Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1
: 1.000

BGM13P BLE, Bluetooth 5.0 I2C, UART, USART 19 dBm 1 Mb/s - 94.8 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin Non-Stocked Lead-Time 24 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

BGM13S BLE, Bluetooth 5.0 I2C, UART 8 dBm 2 Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel
Silicon Labs Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin Non-Stocked Lead-Time 24 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

BGM13S BLE, Bluetooth 5.0 I2C, UART 18 dBm 2 Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel
Panasonic Industry Bluetooth Modules - 802.15.1 2.4 GHZ PAN1781 MODULE Non-Stocked Lead-Time 32 Weeks
Min.: 1
Mult.: 1
: 500

PAN1781 BLE, Bluetooth 5.1 GPIO, I2C, SPI, UART, USB 8 dBm 125 kb/s, 500 kb/s, 1 Mb/s, 2 Mb/s - 92 dBm, - 95 dBm, - 103 dBm 2.44 GHz 1.7 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Wurth Elektronik Bluetooth Modules - 802.15.1 WIRL-BTLE Proteus-I 4.2 w/50 Ohm RF pad Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500

WIRL-BTLE Proteus-I BLE, Bluetooth 4.2 Serial 3 dBm 1 Mb/s - 96 dBm 2.44 GHz 1.8 V 3.6 V - 40 C + 85 C Reel
Wurth Elektronik Bluetooth Modules - 802.15.1 WIRL-BTLE Proteus-II 5.0 w/50 Ohm RF pad Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
: 500

Proteus-II BLE, Bluetooth 5.0 UART 3 dBm 2 Mb/s - 96 dBm 2.44 GHz 1.8 V 3.6 V - 40 C + 85 C Reel


Infineon Technologies Bluetooth Modules - 802.15.1 BTBLE IOT DM Non-Stocked Lead-Time 39 Weeks
Min.: 1
Mult.: 1
: 500

Bluetooth 5.0, BR/EDR Class 1 I2C, I2S/PCM, SPI, UART 10.5 dBm 2 Mb/s - 94.5 dBm 2.4 GHz 2.6 V 3.3 V - 30 C + 85 C Reel, Cut Tape
Kaga FEI Bluetooth Modules - 802.15.1 BLE 5.0 (nRF52810) 2Mbps mode, antenna, ARM M4 24kB RAM, 3.25 x 8.55 x 1.00 mm module Non-Stocked
Min.: 2.000
Mult.: 2.000
: 2.000

BLE 4 dBm 2 Mb/s - 93 dBm 2.402 GHz to 2.48 GHz 1.7 V 3.6 V - 40 C + 85 C Reel
Silicon Labs Bluetooth Modules - 802.15.1 BGM13S22F512G Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of Dep Non-Stocked
Min.: 1.000
Mult.: 1.000
: 1.000

BGM13S BLE, Bluetooth 5.0 I2C, UART, USART 8 dBm 2 Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel
Silicon Labs Bluetooth Modules - 802.15.1 BGM13S22F512GN Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of De Non-Stocked
Min.: 260
Mult.: 260

BGM13S BLE, Bluetooth 5.0 Serial 8 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Silicon Labs Bluetooth Modules - 802.15.1 BGM13S32F512GN Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of De Non-Stocked
Min.: 260
Mult.: 260

BGM13S BLE, Bluetooth 5.0 Serial 18 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Silicon Labs Bluetooth Modules - 802.15.1 BGM111E Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, U.FL Connector Non-Stocked
Min.: 1
Mult.: 1

BGM111 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART 8 dBm 1 Mb/s - 92 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Cut Tape