+ 85 C Multiprotocol Modules

Results: 619
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Qualification Packaging
NXP Semiconductors Multiprotocol Modules IW611HN/A1C
25Expected 10/29/2026
Min.: 1
Mult.: 1
: 2.000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
517Expected 9/8/2026
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
786On Order
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
Murata Electronics Multiprotocol Modules Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2.675On Order
Min.: 1
Mult.: 1
: 1.000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Advantech Multiprotocol Modules Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R,M.2 2230 E key (Wi-Fi: PCIe/BT:USB)
14On Order
Min.: 1
Mult.: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7
Adafruit 5344
Adafruit Multiprotocol Modules ESP32 Dual Antenna WiFi + Bluetooth Module with 8MB FLASH - ESP32-WROOM-DA-N8
4Expected 11/20/2026
Min.: 1
Mult.: 1

2.4 GHz 0 dBm, 19.5 dBm ADC, DAC, GPIO, I2C, I2S, IR, PWM, SD Card, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 35.6 mm x 34.4 mm x 3.5 mm Bluetooth, Bluetooth 4.2 802.11 b/g/n
Murata Electronics Multiprotocol Modules RF TXRX MODULE 5.4/WIFI 6
1.000Expected 12/22/2026
Min.: 1
Mult.: 1
: 1.000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules
100On Order
Min.: 1
Mult.: 1
- 40 C + 85 C 16.6 mm x 13 mm x 2.05 mm Bluetooth, BLE IEEE802.11 a/b/g/n/ac
Quectel Multiprotocol Modules 2.4 GHz + 5 GHz + 6 GHz,Triple-band Wi-Fi 7, BT6.0 dual-mode
100Expected 9/7/2026
Min.: 1
Mult.: 1
: 250
2.4 GHz, 5 GHz, 6 GHz 3 V 3.6 V - 30 C + 85 C 15 mm x 13 mm x 1.8 mm Bluetooth WiFi, 802.11 a/b/g/n/ac/ax/be Reel, Cut Tape
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
110Expected 10/9/2026
Min.: 1
Mult.: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: LCC(ANT_WIFI/BT), 2MB flash
100Expected 7/21/2027
Min.: 1
Mult.: 1
: 500

2.4 GHz 6 dBm, 13 dBm, 14 dBm, 15 dBm, 16 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 20 mm x 18 mm x 2.6 mm Bluetooth 5.2 Wi-Fi 4 Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
100Expected 8/21/2026
Min.: 1
Mult.: 1
: 1.000
2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6, IEEE 802.11a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
100On Order
Min.: 1
Mult.: 1
: 1.000
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6, IEEE 802.11a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
90Expected 9/11/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules NXP platform, SDIO Interface
100Expected 8/20/2026
Min.: 1
Mult.: 1
: 1.000
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
SparkFun Multiprotocol Modules The Digi XBee 3 global cellular module is a cutting-edge compact module engineered for rapid integration of cellular IoT capabilities. This innovative solution is equipped with cellular and BLE connectivity with end-device carrier certifications an Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
23 dBm SPI, UART, USB 3.3 V 4.3 V - 40 C + 85 C SMA 32.94 mm x 24.38 mm BLE LTE-M/NBIoT GNSS
Espressif Systems Multiprotocol Modules 2.4 GHz Wi-Fi 6, Bluetooth 5.4 (LE), Bluetooth Classic, Zigbee and Thread (802.15.4) module Built around ESP32-S31 series of SoCs, RISC-V 32-bit dual-core microprocessor 54 GPIOs, rich set of peripherals On-board PCB antenna Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
DFRobot Multiprotocol Modules Gravity: CAT1 SIM7600G Global 4G Communication and GNSS Positioning Module (10Mbps/5Mbps)
Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

1.9 GHz 5 V 12 V - 40 C + 85 C 60 mm x 52 mm GPS, BD, GLONASS Bulk
NXP Semiconductors Multiprotocol Modules IW611HN/A1C Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I Non-Stocked Lead-Time 3 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel
Embedded Artists Multiprotocol Modules 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Embedded Artists Multiprotocol Modules 1XL M.2 Wi-Fi6 a/b/g/n/ac/ax MU-MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ1XL Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Bulk
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this Non-Stocked
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel