Tray Multiprotocol Modules

Results: 164
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Packaging
u-blox M2-JODY-W683-00C
u-blox Multiprotocol Modules M.2 card with JODY-W683, in tray
280Expected 2/12/2027
Min.: 1
Mult.: 1

Tray
u-blox Multiprotocol Modules M.2 card with JODY-W377, single package
23Expected 7/23/2026
Min.: 1
Mult.: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Microchip Technology Multiprotocol Modules Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144Expected 9/24/2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Quectel Multiprotocol Modules Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, data only application, North America, mPCIe form factor
100On Order
Min.: 1
Mult.: 1

824 MHz to 960 MHz, 1.71 GHz to 2.17 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel Multiprotocol Modules Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
98Expected 8/6/2026
Min.: 1
Mult.: 1

Tray
Insight SiP Multiprotocol Modules WiFi 6/BLE module based on NXP RW612 chip (in tray) Non-Stocked Lead-Time 2 Weeks
Min.: 100
Mult.: 100

Tray
NXP Semiconductors Multiprotocol Modules AW693PHNB/A1ZDB Non-Stocked Lead-Time 3 Weeks
Min.: 840
Mult.: 840

2.4 GHz, 5 GHz to 7 GHz UART 11 mm x 11 mm x 0.85 mm Bluetooth 5.3 Wi-Fi 6/6E Tray
NXP Semiconductors Multiprotocol Modules IW610FHN/A1ZDI Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1C Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW612HN/A1C Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Tray
NXP Semiconductors Multiprotocol Modules IW612HN/A1I Non-Stocked Lead-Time 3 Weeks
Min.: 1.300
Mult.: 1.300

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Tray
Ezurio Multiprotocol Modules Module, Sterling LWB+, M.2, Key E, SDIO, UART Non-Stocked Lead-Time 26 Weeks
Min.: 900
Mult.: 900

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Ezurio Multiprotocol Modules 60 Series, Sterling Module w/u.FL, USB/UART Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Ezurio Multiprotocol Modules 60 Series, Summit Module w/u.FL, USB/USB, (NXP Cortex A5, 88W8997) Non-Stocked
Min.: 100
Mult.: 100

60-2230C Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/CIC/CE

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. U.FL for External Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C u.FL 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotocol Modules 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with Chip Antenna. Certified FCC/IC/CE Non-Stocked
Min.: 980
Mult.: 196

2.4 GHz 17 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C Chip 14.5 mm x 34 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Inventek Multiprotocol Modules 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with U.FL. Certified FCC/IC/CE Non-Stocked
Min.: 980
Mult.: 196

BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems Multiprotocol Modules SMD module, ESP32-PICO-V3-02 with 8 MB flash and 2 MB PSRAM die inside, ESP32 ECO V3, IPEX antenna Non-Stocked Lead-Time 14 Weeks
Min.: 6.500
Mult.: 6.500
Tray
Insight SiP Multiprotocol Modules ISP3010-UX nRF52832 BLE 5 Module Non-Stocked
Min.: 50
Mult.: 50
2.4 GHz 4 dBm SPI 1.8 V 6 V - 30 C + 85 C Built-In 14 mm x 14 mm x 1.5 mm Bluetooth 5.0 Tray
u-blox Multiprotocol Modules M.2 card with JODY-W377, in tray, SDIO interface Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1

2.5 GHz, 5 GHz 16 dBm, 19 dBm I2S, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
u-blox Multiprotocol Modules M.2 card with MAYA-W271, in tray Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz GPIO, SPI, UART u.FL 22 mm x 30 mm x 2.8 mm 802.11 a/b/g/n/ac/ax Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module,u.FL Antenna Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray