-ar Multiprotocol Modules

Results: 240
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Ezurio Multiprotocol Modules Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
Datasheet
250Expected 9/2/2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Texas Instruments Multiprotocol Modules SimpleLink multipro tocol 2.4-GHz wirele
Datasheet
1.900Expected 10/1/2026
MouseReel Available
Min.: 1
Mult.: 1
: 2.000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Seeed Studio Multiprotocol Modules Seeed Studio XIAO nRF52840(Tape & Reel)
Datasheet
51On Order
Min.: 1
Mult.: 1

u-blox Multiprotocol Modules Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
Datasheet
750Expected 12/31/2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
Texas Instruments Multiprotocol Modules SimpleLink multipro tocol 2.4-GHz wirele
Datasheet
1.968Expected 9/3/2026
MouseReel Available
Min.: 1
Mult.: 1
: 2.000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Seeed Studio Multiprotocol Modules Seeed Studio XIAO nRF52840 Sense(Tape & Reel)
Datasheet
54On Order
Min.: 1
Mult.: 1

Silicon Labs Multiprotocol Modules MGM220P wireless gecko
Datasheet
188Expected 9/18/2026
Min.: 1
Mult.: 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Cut Tape
Microchip Technology Multiprotocol Modules Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
Datasheet
144Expected 9/24/2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics Multiprotocol Modules Type 2NR BLE Module
Datasheet
100Expected 3/1/2027
Min.: 1
Mult.: 1
: 1.000

2.48 GHz 8 dBm I2C, SPI 1.7 V 3.4 V - 40 C + 105 C U.FL 7.4 mm x 7 mm x 1.4 mm Bluetooth Reel, Cut Tape
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
110Expected 10/9/2026
Min.: 1
Mult.: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Embedded Artists Multiprotocol Modules 1XL M.2 Wi-Fi6 a/b/g/n/ac/ax MU-MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ1XL
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Bulk
Embedded Artists Multiprotocol Modules 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 2MB PSRAM in IC package, 8MB Flash in module
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 1
Mult.: 1
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Embedded Artists Multiprotocol Modules 2DL M.2 Module Non-Stocked
Min.: 1.000
Mult.: 1

2.4 GHz to 5 GHz SPI 3 V 3.6 V - 40 C + 85 C Bulk
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 8MB Flash in IC package?
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 700
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
Silicon Labs Multiprotocol Modules 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Ezurio Multiprotocol Modules Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 1.000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Inventek Multiprotocol Modules
Datasheet
Non-Stocked
Min.: 2.000
Mult.: 2.000
: 2.000

2.4 GHz 17 dBm I2S, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 10 mm x 10 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel
Ezurio Multiprotocol Modules Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 1.000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotocol Modules Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel

Embedded Artists Multiprotocol Modules 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
Datasheet
Non-Stocked
Min.: 1.000
Mult.: 1

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi