STMicroelectronics IIS3DWB30IS 3-Axis Digital Vibration Sensor
STMicroelectronics IIS3DWB30IS 3-Axis Digital Vibration Sensor is a system-in-package (SiP) device designed for high-accuracy vibration monitoring in industrial environments. The sensor combines low noise with an ultrawide, flat frequency response for precise vibration analysis. The sensor operates in demanding conditions with temperatures up to +125°C and features selectable full-scale ranges of ±50g, ±100g, ±200g, and ±400g. The device measures vibrations with bandwidths exceeding 30kHz for advanced condition monitoring applications. Stable sensitivity and repeatable performance support reliable predictive maintenance and equipment health assessments.
An integrated 2048-slot FIFO buffer helps prevent data loss and reduces processor workload. The STMicroelectronics device also incorporates an intelligent sensor processing unit (ISPU) for real-time signal processing and edge AI execution. Programmable in C language, the ISPU enables low-power industrial sensing solutions for Industry 5.0 applications.
The STMicroelectronics IIS3DWB30IS includes an embedded temperature sensor and self-test functionality for enhanced system reliability. The low-power architecture makes the sensor suitable for wireless sensor nodes and continuous monitoring systems. These capabilities make the device ideal for predictive maintenance, condition monitoring, and industrial automation applications.
Features
- 3-axis vibration sensor with digital output
- User-selectable full scale - ±50g, ±100g, ±200g, ±400g
- Ultrawide frequency response range from DC up to 33kHz
- Equalization and filtering guarantee a flat and alias-free frequency response
- Ultralow noise density down to 35µg/√Hz
- Embedded ISPU with an ultralow-power, high-performance programmable core to execute real-time signal processing and edge AI algorithms
- High stability of the sensitivity over temperature and against mechanical shocks
- Supports accurate external clock input in order to enable precise synchronization of an array of sensors and to improve ODR stability
- Extended -40°C to +125°C temperature range
- Multiple operating modes
- Ultrawide bandwidth continuous mode (UW CM) - 80/160kHz ODR at >25kHz bandwidth
- Continuous mode (CM)
- 40/80/160kHz ODR at >10 kHz bandwidth
- 2.5/5/10/20kHz ODR at ODR/2 bandwidth
- Burst mode (BM) - configurable burst of acquisitions in CM mode triggered by the ISPU, FIFO, internal timer, or external conditions
- Low power - 1.9mA with one axis active, 4.1mA with all three axes active
- SPI serial interface/MIPI I3C serial interface
- Embedded FIFO - 2048 slots with configurable batching for accelerometer, temperature sensor, and ISPU data
- Embedded temperature sensor
- Embedded self-test
- Benefits
- Enables accurate vibration monitoring in industrial applications
- Detects small acceleration changes thanks to low noise and wide bandwidth
- Works reliably in harsh environments with an extended temperature range up to +125°C
- Supports high-g measurement up to ±400g for demanding use cases
- Reduces data loss with the integrated 2048-slot FIFO
- Lowers host processor workload by batching sensor data onboard
- Enables real-time edge processing through the embedded ISPU
- Supports edge AI and signal processing directly on the sensor
- Improves power efficiency for wireless sensor nodes and always-on monitoring
- Simplifies system design with integrated sensing, processing, and self-test capability
- 1.7V to 3.6V supply voltage range
- Compact 4.5mm x 4.5mm x 1.5mm 16-lead LGA package with wettable flanks
- ECOPACK and RoHS compliant
Applications
- Vibration monitoring
- Condition monitoring
- Predictive maintenance
- Test and measurement
Resources
- Datasheet
- Technical Note TN0018 - Handling, mounting, and soldering guidelines for MEMS devices
Block Diagram
Pin Connections
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