Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks
Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks feature a spread-fin array to maximize surface-area cooling and deliver excellent thermal performance. Effective convection cooling from the spread-fin arrays enables a 20% lower junction temperature and a 40% reduction in thermal resistance compared to straight-fin and pin-fin sinks. Whenever higher cooling capacity is required, maxiFLOW heat sinks with thermal tape can be used, and the double-sided adhesive thermal tape enables the attachment of the heat sink to the device. Advanced Thermal Solutions maxiFLOW Cross-Cut Heat Sinks meet the thermal requirements of various electronics packages, including BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, and LQFP.
Features
- Low-profile design
- Spread fin array
- 20% higher thermal performance than a straight or pin fin
- Provided with pre-assembled Chomerics T412 double-sided adhesive
Videos
Related Products
Advanced Thermal Solutions pushPIN™ Heat Sinks & Attachments
Available in many variations and offers wide specifications, ideal for any project.