Digi XBee® 3 BLU Modules
Digi XBee® 3 BLU Modules deliver an easy-to-use BLUETOOTH® solution for designers, OEMs, and providers supporting Bluetooth LE 5.4 for industrial wireless IoT connectivity. The device offers a -40°C to +85°C industrial temperature range for various industrial applications. The Digi pre-certified modules are available in the classic XBee form factors (micro and through-hole). The modules deliver MicroPython programmability, beaconing, Bluetooth sensor support, and the Digi XBee Mobile App to fast-track use in industrial wireless projects.
The XBee 3 BLU modules are a leading product in the Digi XBee ecosystem of wireless modules, adapters, tools, and software. The devices are engineered to accelerate product and application development, deployment, and management. Built-in Digi TrustFence® security, identity, and data privacy attributes use multiple layers of control to defend against new and evolving cyberthreats. Bluetooth Low Energy also adds security through pairing, bonding, and encrypted advertising. Further, all Digi XBee modules integrate the Digi TrustFence security framework, which comprises secure boot, hardware cryptographic acceleration, and true random number generation.
Standard XBee API frames, AT commands, MicroPython, and Digi XBee Studio make setting up, configuring, and testing modules or modernizing the functionality easy.
Features
- Designed for a range of use cases, from maker projects to industrial applications
- Industrial-rated on a Bluetooth module
- Integrated MicroPython programmability for edge computing
- Bluetooth Low Energy for beaconing, connecting to sensors, and local configuration using the Digi XBee Mobile App
- Easily detect modules and connect to smart devices
- Low power consumption optimized for long battery life
- Integrated with Digi TrustFence security framework
- Manage, configure, and test with Digi XBee Studio
- Accelerate app development with Digi IoT Mobile SDK
- Digi XBee API functionality and support
- Over-the-air (OTA) firmware updates with Digi XBee Mobile App
- Complete Bluetooth LE 5.4 software stack
Specifications
- UART and SPI serial data interface
- API or AT commands, local or over-the-air (OTA) configuration method
- ISM 2.4GHz frequency band
- Micro (MMT), through-hole (TH) form factor
- FSK (frequency-shift keying) interference immunity
- Four 10-bit ADC inputs
- 13 digital I/O
- 1MB/96kB RAM memory
- Antenna options
- Micro: U.FL antenna, RF pad, chip antenna
- Through-hole: PCB antenna, U.FL connector
- -40°C to +85°C operating temperature range
- Dimensions (L x W x H)
- 13mm x 19mm x 2mm (0.533" x 0.76" x 0.087") micro
- 2.438cm x 2.761cm (0.96" x 1.087") through-hole
Videos
Application Example
Development Kit
Digi XBee® 3 BLU Development Kit
Kit integrates compact, flexible BLUETOOTH® Low Energy connectivity for IoT devices.
Associated XBee® Modules
Digi XBee® Family RF Modules
Designed to leverage wireless technology with the right combination of expertise and resource.