Infineon Technologies CoolMOS™ C7 Gold (G7) Power MOSFETs

Infineon Technologies CoolMOS™ C7 Gold (G7) Power MOSFETs are housed in the SMD TO-Leadless (TOLL) package using the Kelvin source concept. The G7 MOSFETs combine improved 600V and 650V CoolMOS™ G7 technology, 4-pin Kelvin source capability, and the improved thermal properties of the TO-Leadless package. This enables an SMD solution for high current hard switching topologies like power factor correction (PFC) up to 3kW. For the 600V CoolMOS™ G7, the MOSFETs can be used for resonant circuits like high-end LLC.

The CoolMOS™ G7 technology offers higher efficiency, faster switching, and improved power density due to low RDS(on). The G7 are housed in a small footprint and reduce production cost through quicker assembly times.

Features

  • Best-in-class FOM RDS(on) x Eoss and RDS(on)x QG
  • Best-in-class RDS(on) in smallest footprint
  • Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance (~1nH)
  • Is MSL1 compliant, total Pb-free, has easy visual inspection grooved leads
  • Enables improved thermal performance Rth
  • Reducing parasitic source inductance by Kelvin source improves efficiency switching and ease-of-use
  • TOLL package is easy to use and has the highest quality standards
  • Improved thermals enable SMD TOLL package to be used in higher current designs than has been previously possible
  • 650V G7: FOM RDS(on) x QGis 14% better than the previous 650V CoolMOS™ C7, enabling higher efficiency
  • 600V G7: FOM RDS(on) x QGis 16% better than the previous 600V CoolMOS™ C7, enabling higher efficiency
  • 650V G7: Power density through best-in-class 33mΩ in 115mm2 TOLL footprint
  • 600V G7: Power density through best-in-class 28mΩ in 115mm2 TOLL footprint

Applications

  • Telecom
  • Server
  • Solar
  • Industrial SMPS
Published: 2018-04-11 | Updated: 2024-08-08