Kingston e•MMC™5.1 HS400 & LPDDR4X eMCPs

Kingston e•MMC™5.1 HS400 and LPDDR4X eMCPs are multi-chip package memory devices that incorporate an e•MMC (JESD84-B51) and low-power DDR4X (JESD209-4-1) synchronous dynamic RAM.

The Kingston e•MMC device is an embedded flash memory storage solution with a MultiMediaCard interface (e•MMC). The e•MMC controller instantly manages NAND flash, including error control, wear-leveling, IOPS optimization, and read sensing.

The device is ideal for use in the data memory of mobile communication systems, reducing not only PCB size but also power consumption. The eMCPs are housed in a 254-ball FBGA-type package.

Features

  • Embedded multi-media storage and LPDDR4X DRAM combined into a single multi-chip package
  • JEDEC 254 ball FBGA type 11.5mm x 13.0mm x (max 1.0mm) package
  • –25°C to +85°C operating temperature range

Specifications

  • 32EM16-M4JTQ0A-01011
    • 32GB NAND density
    • 16Gb DRAM density
    • 2CH, 1CS, CH, and CS DRAM
    • Operating voltage
      • VCC =3.3V, VCCQ =1.8V
      • VDD1 = 1.8V, VDD2 = 1.1V, VDDQ = 0.6V
  • 32EM32-M4KTQ0A-01011
    • 32GB NAND density
    • 32Gb DRAM density
    • Operating voltage
      • VCC=3.3V, VCCQ=1.8V
      • VDD1 = 1.8V, VDD2= 1.1V, VDDQ = 0.6V

Device Block Diagram

Block Diagram - Kingston e•MMC™5.1 HS400 & LPDDR4X eMCPs

LPDDR4X Block Diagram for 32GB

Block Diagram - Kingston e•MMC™5.1 HS400 & LPDDR4X eMCPs

LPDDR4X Block Diagram

Block Diagram - Kingston e•MMC™5.1 HS400 & LPDDR4X eMCPs

Layout

Location Circuit - Kingston e•MMC™5.1 HS400 & LPDDR4X eMCPs
Published: 2025-05-20 | Updated: 2025-05-30