NXP Semiconductors i.MX 8M Nano Applications Processor

NXP Semiconductors i.MX 8M Nano Applications Processor provides affordable performance for smart, connected, power-efficient devices requiring graphics, vision, voice control, intelligent sensing, and general-purpose processing. The i.MX8M Nano processors are part of NXP’s EdgeVerse™ edge computing platform. The i.MX 8M Nano Processors also offer a wide range of capabilities in terms of system connectivity (PCIe, Gbit Ethernet, SDIO/eMMC, USB 2.0, MIPI-CSI, MIPI-DSI) and memory interface flexibility (LPDDR4, DDR4, DDR3L). This makes these devices extremely applicable to a broad spectrum of non-media-rich general-purpose applications requiring high performance, power-efficient operation, and low system cost.

The i.MX 8M Nano family of processors features an advanced implementation of a quad Arm® Cortex®-A53 core, which operates at speeds of up to 1.5GHz. A general-purpose Cortex-M7 running up to 750MHz core processor is for real-time and low-power processing.

The i.MX 8M Nano family of processors provides additional computing resources and peripherals:

  • Advanced security modules for secure boot, cipher acceleration, and DRM support
  • A wide range of audio interfaces, including I2S, AC 97, TDM, and S/PDIF
  • Large set of peripherals that are commonly used in the consumer and industrial markets, including USB and Ethernet

The i.MX 8M Nano Applications Processors feature a 14mm x 14mm FCBGA package, and are pin-compatible for maximum scalability.

Features

  • Up to 4x Arm® Cortex®-A53 core platforms with NEON™ SIMD and floating-point unit (FPU) delivers advanced compute performance
    • Up to 1.5GHz per core
    • 64-bit Armv8-A architecture
    • 32 KB L1-I Cache / 32 KB L1-D Cache
    • 512 KB unified L2 Cache
  • 1x Arm Cortex-M7 core platform for low-power system control/standby
    • Up to 750MHz
    • 256 KB Tightly Coupled Memory (TCM)
  • On-chip memory
    • On-chip RAM (512 KB + 32 KB)
  • Flexible memory interface enables highest performance and lowest standby power (LPDDR4), or lowest system cost (DDR3L, DDR4)
    • 16-bit DRAM interfaces: LPDDR4-3200, DDR4-2400, DDR3L-1600
    • 8-bit NAND-Flash, including support for Raw MLC/SLC devices, BCH ECC up to 62-bit, and ONFi3.2 compliance
    • eMMC 5.1 Flash (3 interfaces), SPI NOR Flash (3 interfaces), QuadSPI Flash with support for XIP
  • Multimedia
    • GC7000UL GPU, 2 x shader, Supports OpenGL® ES 1.1, 2.0, 3.0, OpenCL2, Vulkan
    • LCDIF Display Controller supports up to 1080p60 display
    • Display: 1x MIPI DSI (4-lane) with PHY
    • Camera: 1x MIPI CSI (4-lane) with PHY
    • Audio: 5 Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP, S/PDIF and DSD interfaces:
      • 1 SAI with 4 Tx and 4 Rx lanes
      • 2 SAI with 2 Tx and 2 Rx lanes
      • 2 SAI with 1 Tx and 1 Rx lanes
    • Pulse Density Modulation (PDM) input
  • Connectivity:
    • 1x USB 2.0 OTG controllers with integrated PHY interfaces
    • 3x SDIO3.0 / eMMC5.1 / SDXC
    • 1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power
    • 4x UART, 4x I2C modules, 3x ECSPI modules
    Security:
    • Resource Domain Controller (RDC) supports four domains and up to eight regions of DDR
    • Arm TrustZone (TZ) architecture:
      • Support Arm Cortex-A53 MPCore TrustZone
    • On-chip RAM (OCRAM) secure region protection using OCRAM controller
    • High Assurance Boot (HAB)
    • Cryptographic acceleration and assurance (CAAM) module:
      • Support Widevine and PlayReady content protection
      • Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
      • Real-time integrity checker (RTIC)
      • DRM support for RSA, AES, 3DES, DES
      • Side channel attack resistance
      • True random number generation (RNG)
      • Manufacturing protection support
    • Secure non-volatile storage (SNVS):
      • Secure real-time clock (RTC)
    • Secure JTAG controller (SJC)
  • Package & Qualification:
    • FCBGA options
      • 14mm x 14mm, 0.5mm pitch
      • 11mm x 11mm, 0.5mm pitch 
    • Commercial (Tj = 0℃ to +95℃) and Industrial (-40℃ to +105℃) options to suit application operating conditions 

Applications

  • Embedded Industrial IoT
    • Industrial printer
    • Ruggedized HMI
    • Machine visual inspection
    • Factory automation
    • Test and measurement equipment
    • Mobility and logistics
    • Image or barcode scanners
  • Smart Building
    • Smart appliances
    • Smart light control
    • HVAC climate control
    • Service robots (vacuum cleaner etc.)
    • Video doorbell
    • IoT gateway
    • Elevator control panels
    • Machine Learning e.g. face/voice recognition, anomaly detection
  • Healthcare
    • Mobile patient care, e.g. infusion pump, respirator
    • Blood pressure monitor
    • Activity/wellness monitor
  • Consumer Appliances
    • Portable audio devices
    • Soundbars
    • Wireless/networked speakers
    • Audio/video receiver
    • Public address systems

Block Diagram

Block Diagram - NXP Semiconductors i.MX 8M Nano Applications Processor
Published: 2019-11-14 | Updated: 2024-12-09