Octavo Systems OSD62x-PM System-in-Package (SiP)

Octavo Systems OSD62x-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components. This device features up to quad-core 64-bit Arm® Cortex®-A53 at 1.4GHz, a single-core Arm® Cortex®-M4F at 400MHz, and up to 2GB of DDR4 memory. The OSD62x-PM SiP features a 3D graphics processing unit that supports up to 2048x1080 @60fps and OpenGL ES 3.1 and Vulkan 1.2. The display subsystem supports 2x 1920x1080 @ 60fps, 24-bit RGB parallel interface, and OLDI/LVDS (4 lanes-2x). The OSD62x-PM SiP is available in a single 9mm x 14mm BGA package with a -40°C to 85°C industrial temperature range. Typical applications include building and industrial automation/control, IoT gateway, Artificial Intelligence (AI) at the edge, and Human Machine Interface (HMI).

Features

  • Integrated into a 9mm X 14mm BGA package:
    • Texas Instruments AM62
    • DDR4
    • Passives
  • AM62:
    • Up to 4x Arm® Cortex®-A53 @1.4GHz
    • Arm® Cortex®-M4F @400MHz
    • Display subsystem:
      • Supports 2x 1920x1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x)
      • 24-bit RGB parallel interface
    • 3D graphics processing unit:
      • Supports up to 2048×1080 @60fps
      • OpenGL ES 3.1, Vulkan 1.2
  • Access to all AM62 peripherals includes:
    • MIPI CSI 1.3 compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet switch
    • Support for Time Sensitive Networking (TSN)
    • 2x USB2.0 ports
    • 9x UART, 5x SPI, 6x I2C, and 3x McASP
    • 3x ePWM, 3x eQEP, and 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, and 1x GPMC
  • -40° to 85°C industrial temperature range 

Applications

  • Building and industrial automation/control
  • IoT gateway
  • Artificial Intelligence (AI) at the edge
  • Human Machine Interface (HMI)

Block Diagram

Block Diagram - Octavo Systems OSD62x-PM System-in-Package (SiP)
Published: 2025-07-09 | Updated: 2025-08-14